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Staff Engineer, Packaging Engineering

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Location: Taichung, TXG, Taiwan 
Req ID: JR-0000040574


Staff Engineer, Packaging Engineering

Location: Taichung City, Taiwan
Req ID: JR-0000040574

Western Digital®

We deliver the possibilities of data. YOU define what’s possible.


  • Perform package substrate design including flip chip, FCBGA, Hybrid BGA and WB BGA products. 
  • Provide optimal PKG fitment/placement proposal according to PKG design rule and design guideline. 
  • Perform Design Library maintenance and bonding diagram generation.
  • Perform cost/performance tradeoff analysis of various packages either in production or under development. 
  • Interface seamlessly with product managers, substrate designers, manufacturing and assembly engineering and layout groups at the assembly subcontractors. 
  • Work closely with various manufacturing and packaging groups at various WDC locations for new product development and substrate / PCB design improvement. 
  • Work with assembly houses and substrate / PCB vendors on design review and design rule maintenance.


  • Bachelor's Degree or above, at least 5 years of relevant experience.
  • Good knowledge in flip chip die's bump lay out placement and PKG SI/PI.
  • The ability to work with substrate and other laminate material suppliers, directly. 
  • Good command of written and oral English
  • Logical thinking, good teamwork spirit.


Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.