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Principal Engineer, Failure Analysis Engineering

Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-0000039603


Principal Engineer, Failure Analysis Engineering

Location: Batu Kawan, Penang

We deliver the possibilities of data. YOU define what’s possible.

Perform package and device analysis on new product qualification, assembly test failure from production. Define the FA flow for each FA case. Generate technical FA report and assist process engineer for root-causing of defect/s. SME on equipment and maintain the FA tracking. Develop new FA process and FA capability for new product and new technologies.
Qualifications, experience
  • Bachelor Degree and/or Master in Electrical/ Electronic/Material Science/Chemistry with minimum 5 years in failure analysis
  • Familiar with memory product technology and structure
  • Familiar with semiconductor and SMT assembly process and technology
  • Familiar with wafer fab process.
  • Understand memory product test process and methodology
  • Skillful in performing Failure Analysis in SMT, package and device analysis failure.
  • Strong technical knowledge on 3D X-ray, TDR, FIB, TEM, SEM/EDX, curve tracer analysis and CSAM.
  • Good communication and presentation skills
  • Good teamwork spirit
  • Fluent in English speaking, reading and technical FA report writing 

Generic & Functional Skills / competencies
  • Technical report writing and presentation skills

Western Digital, HGST, and SanDisk offers a highly competitive compensation package and great benefits. The company provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, creed, gender, national origin, age, disability, marital or veteran status, sexual orientation, gender identity or expression, or any other legally protected status.