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Senior Engineer, Process Engineering

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Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-0000039851


Senior Process Engineer, Die Preparation

Requisition No: JR-0000039851

Location: Batu Kawan, Penang

We deliver the possibilities of data. YOU define what’s possible.


  • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
  • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
  • Responsible for new material/component first articles inspection and final buyoff.
  • Continuous improvement on direct/indirect material cost down & yield enhancement program.
  • Ensure robustness of process control to meet yield & thru-put expectation.
  • Report any non-conformance/customer complains issue and develop/follow up the improvement   actions.
  • Fully participate to resolve the issue thru teamwork, and be the main coordinator for any internal/  external audit programs.



  •      Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering  
  •      5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
  •      Must have experience and knowledge at DP (BG: DAG/DBG; Wafer Saw: Blade Saw/Laser Saw; Taping/De-taping, die separator).
  •      Must be familiar with machine: set up recipe and optimize process parameters to improve process (Especially for BG & Wafer Saw process)
  •      Materials expertise: Die Attach film, FOD, BG tape, Saw Blade, Grinding Wheel, polishing pad etc.
  •      It is better to have the experience on BG/Saw process of small die/thin die.
  •      Develop new recipe with fully process Chz & failures root-cause analysis n improvement,
  •      Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why,5M+1E etc.).
  •      Basic understanding of package level testing & reliability.  
  •      Hands on skill with machine / DP tool setup & PM will be preferred    
  •      A proven desire to work as a team member, both on the same team and outside of the team.
  •      Ability to troubleshoot and analyze complex problems.
  •      Ability to multi-task and meet deadlines.
  •      Excellent English communication (written and verbal) and interpersonal skills.



Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.