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Senior Engineer, DIE ATTACH Manufacturing Equipment Engineering

Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-0000038261

Description


Senior Engineer, DIE ATTACH Manufacturing Equipment Engineering


Requisition No: JR-0000038261

Location: Batu Kawan, Penang
We deliver the possibilities of data. YOU define what’s possible.


Responsibilities

  • To ensure specific machine performance monitoring is carried out.
  • To assist and co-ordinate new project transfer where needed.
  • To continuous upgrading machine performance.
  • Ensuring equipment PM and calibration procedure are maintained and implemented
  • To ensure critical spares inventory is well maintained.
  • To identify key process equipment, provide appropriate resources for machine/equipment maintenance and develop an effective total preventive maintenance system to determine PM and calibration frequency.
  • To initiate activities to reduce equipment downtime.
  • To train subordinate on equipment set up, conversion and troubleshooting.
  • Liaise with engineer to identify critical parameter.
  • Select appropriate measuring and test equipment that will provide the measurement accuracy and precision required.
  • To establish and monitor tooling management as follows:
  • To ensure maintenance facility is well established
  • To ensure the new equipment is set up and buyoff according to industrial standard.
  • To determine equipment spare usage.
  • Tool change programs and documentation.
  • To provide appropriate technical resources for tool and gage design and fabrication.
  • To determine and verify the full dimensional inspection of the tool and gage design.
  • Follow all environmental procedures in carrying out daily activities
  • Highlight to superior any activities in the company that may be contrary to the environment policy
  • Other duties and responsibilities that may be assigned by the company from time to time.
          Requirements
  • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering  
  • 3+ years of equipment engineering experience in semiconductor assembly and manufacturing plant.
  • Must have experience and knowledge at Substrate Baking, Plasma cleaning, Normal Cure, High Pressure Cure with dynamic pressure & Die attach (Hitachi Bonder-DB800)
  • Experience on high die stack up to 8-32Dies
  • In depth understanding & process characterization of die attach material such as DAF (Die Attach Film), FOD (Film on Die) & FOW (Film on Wire).
  • Hands on skill with machine / DA tool setup & PM will be preferred
  • Basic understanding on Die pick-up & place mechanism/concept:3-step ejection.
  • Basic understanding of package level testing & reliability.
  • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why etc.).   
  • A proven desire to work as a team member, both on the same team and outside of the team.
  • Ability to troubleshoot and analyze complex problems.
  • Ability to multi-task and meet deadlines.
  • Excellent English communication (written and verbal) and interpersonal skills.
ABOUT WESTERN DIGITAL
Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.