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Engineer, Packaging Engineering

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Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-0000038614


Process Engineer-Die Attach

Location: Seberang Perai Selatan, Penang


We deliver the possibilities of data. YOU define what’s possible.


  • Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
  • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
  • Responsible for new material/component first articles inspection and final buyoff.
  • Continuous improvement on direct/indirect material cost down & yield enhancement program.
  • Ensure robustness of process control to meet yield & thru-put expectation.
  • Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
  •         Fully participate to resolve the issue thru teamwork, and be the main coordinator for any internal/ external audit programs.



Qualifications, experience

  • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering  
  • 2-5 years of process engineering experience in semiconductor assembly and test manufacturing plant.

        Generic & Functional Skills / competencies

  • Knowledge at Die Attach will be added advantage.
  • Familiar with machine: set up recipe and optimize process parameters to improve process
  • Knowledge in Materials such as Die Attach film, needless ejector design, rubber tip etc. will     be added advantage.
  • Develop new recipe with fully process Chz & failures root-cause analysis and improvement,
  • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why, 5M+1E etc.).
  • Basic understanding of package level testing & reliability.  
  • Hands on skill with machine (Hitachi Bonder 700/800/830) / tool setup will be preferred
  •  A proven desire to work as a team member, both on the same team and outside of the team.
  •  Ability to troubleshoot and analyze complex problems.
  •  Ability to multi-task and meet deadlines.
  •   Excellent English communication (written and verbal) and interpersonal skills.



Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.