• Performing deep electrical failure analysis during new product development and ramping phase. Shoot failures from both wafer level and package level. Create analysis report based on FA finding and define the action plans after communication with stockholders (Device engineer, Design engineers, Fab product engineer, etc.)• Monitor memory health level and DPPM pareto for miscellaneous product lines. Work with FAB/device to improve and fine tune the fab process for DPPM reduction.• Define the test flow, screen/stress method based on root cause analysis of failures. Work with TE to come up with detail plans and drive for implementation.