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Engineer, Packaging Engineering

Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-9999035318


Engineer, Packaging Engineering

Location: Batu Kawan, Penang

Req ID: JR-9999035318

We deliver the possibilities of data. YOU define what’s possible.


  • Responsible for SMT equipment issue and able to troubleshoot the root cause & apply precise corrective action to the issue.
  • Can handle machine conversion/setup independently for Solder Paste Printer/ SPI/ Chip shooter/ Reflow /Flux cleaning/ AOI.
  • Can understand, perform SMT machine programming & stencil design.
  • Define and develop process from SMT to Back End include Press Fit, Wave soldering and mechanical assembly.
  • Able to read Garber data and define stencil design.
  • Involved in yield improvement activities using statistic tools and drive yield meeting with internal and external team.
  • Basic understanding of package level testing & reliability.
  • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why etc.).  
  • A proven desire to work as a team member, both on the same team and outside of the team.
  • Ability to troubleshoot and analyze complex problems.
  • Ability to multi-task and meet deadlines.
  • Excellent English communication (written and verbal) and interpersonal skills.
  • Bachelor degree or above in Mechanical/Material/Electrical/Physics Engineering
  • Accept flexible working time.


Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.