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Manager, Packaging Engineering

Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-9999035316


Manager, Packaging Engineering

Location: Batu Kawan

We deliver the possibilities of data. YOU define what’s possible.


  • ·Well experienced with the packaging processes (die preparation, die attach, wire bond and mold) and related advance technologies
    ·Master in materials, methods, equipment related to the packaging technology
    ·Basic understanding on computational and modelling (FEA, Ansys etc)
    ·Well acquainted with characterization facilities related to packaging engineering
    ·Ability to scale level of involvement from full delegation to hands-on participation when required by the project or business;
    ·Six Sigma Certified or have completed Six Sigma Green Belt Projects preferred; 
    ·Mature minded to drive and lead the cross function team members when project/ business need;
    ·Good leadership and management skills;
    ·Good communication and coordination skills;
    ·Good English including presentation skills.
    ·Self-motivated, self-directed & high passion.
    ·Technical & Packaging Materials expertise.
    ·Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why,TOC etc.).
    ·Basic understanding of package development flow Qual->LVM->HVM, Assembly, test, Package reliability.


Western Digital, HGST, and SanDisk offers a highly competitive compensation package and great benefits. The company provides equal employment opportunities to all employees and applicants for employment without regard to race, color, religion, creed, gender, national origin, age, disability, marital or veteran status, sexual orientation, gender identity or expression, or any other legally protected status.