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Principle Engineer

Location: Hsinchu, Hsinchu County, Taiwan 
Req ID: JR-0000027270

Description

  • Job Description Summary
    • The new hire engineer will be accountable and responsible for the eSSD package designs.
    • Working with ASIC vendors and internal teams to develop the package design solutions
  • Job Description
    • Provide advanced packaging solutions
    • Deliver eSSD package design solutions
    • Cross functional works with Vendors/HW/AVB to meet mechanical/thermal/electrical requirements
    • Document & maintain all packaging & BOM information  
    • Achieve compliance to Industry Standards for RoHS, Halogen Free
  • Qualifications

    •   Bachelor’s degree in Electrical Engineering with 10 years experience in Controller Design.
    • Must be familiar with the most recent Intel and ARM Architectures. 
    •  Familiarity with Marvell and Intel Processors desired and a plus